| Item | TYWSi-1 | TYWSi-2 |
| Appearance | Light yellow transparent liquid | Milky white liquid |
| Density(g/ml, 20 ℃) | 1.055±0.005 | 1.010±0.005 |
| pH(5% aqueous solution) | 5-8 | 7-10 |
| Water content(%) ≤ | 0.1 | 55 |
| Package | 10KGS/plastic bucket General goods | 10KGS/plastic bucket General goods |
Application:
TYWSi-1 is a specialized cutting fluid for diamond wire cutting, with the following main characteristics: 1) excellent lubrication performance and low surface roughness for cutting silicon wafers; 2) The product itself has excellent anti foaming ability and excellent low foaming performance; 3) Low viscosity, good flowability during cutting process, low viscosity of cutting slurry; 4) Excellent settling function, accelerating the sinking speed of cutting micro powder; 5) Corrosion resistance, no corrosion with steel wires and equipment; 6) Good cooling performance, able to instantly remove the heat generated by cutting; 7) The cut silicon wafer is easy to rinse, with no organic matter or metal residue on the surface, which is beneficial for surface texturing of the silicon wafer.
TYWSi-2 is a specialized defoamer for diamond wire cutting, with the following main characteristics: 1) strong defoaming ability, small dosage, rapid elimination, and efficient foam suppression; 2) Excellent permeability and dispersibility; 3) Low surface tension and good surface balance; 4) Stable chemical properties and strong oxidation resistance; 5) Silicon wafer surface has no residue and is easy to clean; 6) Odorless and non corrosive diamond wire.
Usage: Pour the specialized cutting fluid TYWSi-1 and specialized defoamer TYWSi-2 directly into water according to the specified ratio, dilute 400-500 times before use.
